JPH0217501Y2 - - Google Patents

Info

Publication number
JPH0217501Y2
JPH0217501Y2 JP1983143818U JP14381883U JPH0217501Y2 JP H0217501 Y2 JPH0217501 Y2 JP H0217501Y2 JP 1983143818 U JP1983143818 U JP 1983143818U JP 14381883 U JP14381883 U JP 14381883U JP H0217501 Y2 JPH0217501 Y2 JP H0217501Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
board
sub
main board
flat package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983143818U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6052659U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14381883U priority Critical patent/JPS6052659U/ja
Publication of JPS6052659U publication Critical patent/JPS6052659U/ja
Application granted granted Critical
Publication of JPH0217501Y2 publication Critical patent/JPH0217501Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP14381883U 1983-09-16 1983-09-16 フラツトパツケ−ジ集積回路の実装構造 Granted JPS6052659U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14381883U JPS6052659U (ja) 1983-09-16 1983-09-16 フラツトパツケ−ジ集積回路の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14381883U JPS6052659U (ja) 1983-09-16 1983-09-16 フラツトパツケ−ジ集積回路の実装構造

Publications (2)

Publication Number Publication Date
JPS6052659U JPS6052659U (ja) 1985-04-13
JPH0217501Y2 true JPH0217501Y2 (en]) 1990-05-16

Family

ID=30320908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14381883U Granted JPS6052659U (ja) 1983-09-16 1983-09-16 フラツトパツケ−ジ集積回路の実装構造

Country Status (1)

Country Link
JP (1) JPS6052659U (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339784A (en) * 1980-08-11 1982-07-13 Rca Corporation Solder draw pad
JPS57180155A (en) * 1981-04-30 1982-11-06 Nec Corp Vessel for electronic circuit

Also Published As

Publication number Publication date
JPS6052659U (ja) 1985-04-13

Similar Documents

Publication Publication Date Title
JPH0217501Y2 (en])
JPH03215991A (ja) プリント配線板間の電気的接続構造
JPH0747901Y2 (ja) 印刷配線板
JPS5939964U (ja) 配線板
JPS5824459Y2 (ja) 電気部品装着基板
JPH0421257Y2 (en])
JPS6314475Y2 (en])
JP2736553B2 (ja) 混成集積回路
JPS58125373U (ja) プリント配線板
JPS5914394U (ja) 混成集積回路基板
JPS62208691A (ja) 両面実装型混成集積回路
JPS60156768U (ja) 試作用汎用プリント基板
JPS6146769U (ja) 電子回路形成チツプ搭載装置
JPS59163842A (ja) 集積回路ソケツト積重ね実装構造
JPS60130672U (ja) プリント配線基板
JPS5952647U (ja) 混成集積回路
JPS6048271U (ja) 電気回路基板
JPS61150398A (ja) フラツトパツケ−ジの半田付け方法およびそのためのマスク板
JPS6424876U (en])
JPS6324832U (en])
JPS5964249U (ja) サ−マルヘツド
JPS6049669U (ja) チップキャリア型パッケ−ジの接続構造
JPS6073271U (ja) プリント配線板
JPS583064U (ja) フレキシブルプリント基板の接続構造
JPH0631143U (ja) 印刷配線板